|
|
|
|
|
EFD PV Cell Ribbon and Bus Bar Attachment Methodology
DESCRIPTION
The point-to-point soldering process uses a proprietary lead free solder paste and flux mixture to attach string ribbon material to silver bus bars during module assembly. In addition to eliminating the need for pre-coating of ribbon material with liquid flux, the additional metal content augments the solder joint. The method is compatible with both manual and automated assembly operations.
INNOVATIVE ASPECT
Additional metal content, used at specific locations in a point-to-point solering process, has been shown to reduce the amount of microcrack formation and aid in the verification of solder joint formation during module assembly.
BENEFITS
Reduction of microcrack formation during module assembly should facilitate the use of thinner wafers and improve performance over the life of the module. The additional solder alloy increases solder joint toughness, consistency, and durability.
